Search for: All records

In this study, voltage distribution and surface dielectric barrier discharge (DBD) of a microplasma discharge device (MDD) were modeled in 2-D domain using finite-element analysis (FEA). Initially, the voltage distribution across comb-, H-tree-, and honeycomb-structured MDD was analyzed. Then, the cross section of an MDD consisting of a polyimide-based dielectric sandwiched between two copper electrodes was used for modeling the microplasma discharge characteristics in an argon environment. A sinusoidal voltage was applied to one of the copper electrodes while the other electrode was grounded. The spatial distributions of electron temperature (ET) across the electrodes for varying input voltages were simulated to demonstrate the importance of breakdown voltage. A detailed analysis on the effect of varying electrode and dielectric barrier thicknesses on electron density and ET was also performed to understand the importance of optimizing device configurations for microplasma discharge. Moreover, MDD was also simulated in varying ambient temperature and pressure conditions to evaluate their effect on ET and density across the electrodes. The results from these simulations provide a better understanding of parameters such as varying input voltage, electrode, and dielectric thickness on ET and electron density. This enables us to optimize design parameters for fabricating MDDs and the operating conditions for effective sterilization applications.